AM263Px MCU+ SDK: APIs for SDL ECC (ECC_AGGR)

| AM263Px MCU+ SDK 26.00.00 |

Sub Modules
APIs for SDL ECC (ECC_AGGR)
APIs for SDL IP Module

## Introduction

To increase functional safety and system reliability the memories (for example, FIFOs, queues, SRAMs and others) in many device modules and subsystems are protected by error correcting code (ECC). This is accomplished through an ECC aggregator and ECC wrapper. The ECC aggregator is connected to these memories (hereinafter ECC RAMs) and involved in the ECC process. Each memory is surrounded by an ECC wrapper which performs the ECC detection and correction. The wrapper communicates via serial interface with the aggregator which has memory mapped configuration interface. The ECC aggregator is also connected to interconnect ECC components that protect the command, address and data buses of the system interconnect. ECC is calculated for the data bus and parity and redundancy for the command and address buses. Each interconnect ECC component has the same serial interface for communication with the aggregator as the ECC wrapper. An ECC aggregator may be connected to both endpoints the ECC wrapper and interconnect ECC component. The ECC aggregator, ECC wrapper and interconnect ECC component are considered as single entity and are hereinafter referred to as ECC aggregator unless otherwise explicitly specified. The design focusses on SDL function layer providing the configuration for ECC RAM ID, force ECC ram error, ECC aggregator interrupt handling features.

## Sub Modules
| ECC_AGGR Data Structures
| ECC_AGGR Enumerated Data Types
| ECC_AGGR Functions
| ECC_AGGR Macros