Overview

CC13x4_26x4 + CC33xx Architecture

This figure shows a block diagram of the CC33xx + CC13xx/CC26xx MCU solution at a high level. For MCU hosts, this CC33XX package introduces the Thick-MAC concept where the WPA Supplicant and the connection management are implemented within the CC33XX device. This configuration reduces the footprint of the host application and simplifies the Wi-Fi control. Note that having the Supplicant inside the device is different from the Linux Transceiver partitioning used by the MPU based hosts.

Thick MAC block Diagram

The CC13xx/CC26xx host uses an XIP flash to run the application image. The XIP must be larger than 512KB for the basic wi-fi example to work. The current release supports the CC13x4/CC26x4 devices which contains 1MB of XIP flash. Currently the package supports Wi-Fi only example (which includes a TCPIP stack). A typical application will also require a TLS stack and networking protocol stacks (e.g. HTTP or MQTT). If other CC13xx/CC26xx RF interfaces or software components Will be needed, the memory requirements should be updated accordingly. For CC33xx firmware binaries (which is around 400KB) the use of an external serial flash is recommended. The currently supported LP_EM_CC1354P10_6 board contains a 2MB flash which is access through the TI NVS driver over SPI. The provided FirmwareProgrammer application can be used to programs the external flash. It should be used before any other CC33xx application can run on the platform. Upon boot, the operation aplication image will be runs from the XIP flash. When the Wi-Fi is turned on, the application code (through provided Wi-Fi Host Driver) will read the firmware (and bootloader) code from the extarnal flash and inject it to the CC33xx RAM. Check CC33XX Getting Started Guide for more details on running an application. The CC13xx/CC26xx communicates with the CC33xx over SPI. For more details on the host interface, see the CC33XX Host-Driver Porting Guide.